Protect your sensitive electronic components or imaging sensors with our high-precision technical drawing for the 3D-P16 Waterproof Housing. This enclosure is meticulously designed for high-performance applications where exposure to moisture, dust, or high-pressure water jets is a constant threat. The “P16” series design emphasizes a compact yet rugged architecture, making it an ideal choice for outdoor surveillance systems, underwater sensors, or industrial monitoring equipment operating in harsh environments.

Our downloadable drawing provides a comprehensive look at the sealing interfaces and mechanical tolerances required to maintain an airtight and watertight environment. The design features optimized wall thicknesses to balance structural rigidity with thermal dissipation, ensuring that internal electronics remain cool while staying dry. By utilizing the precise dimensions and thread specifications found in this file, engineers can easily integrate the housing into larger assemblies or customize the mounting points to suit specific project needs.

This blueprint includes detailed views of the O-ring grooves and sealing surfaces, which are critical for achieving high IP (Ingress Protection) ratings. Whether you are looking to manufacture this housing via CNC machining or specialized 3D printing processes, these technical files serve as the definitive guide for production. Download the 3D-P16 documentation today to ensure your hardware is shielded by a professional-grade protective solution.

الميزات الرئيسية:

  • Advanced Sealing System: Designed with precision-engineered O-ring grooves to ensure long-term waterproof integrity under pressure.
  • Corrosion-Resistant Architecture: Material specifications optimized for longevity in high-humidity and marine environments.
  • Compact P16 Form Factor: A streamlined external envelope that maximizes internal volume while maintaining a small footprint for tight installations.
  • Versatile Mounting Interfaces: Includes standardized mounting points for easy integration with brackets, tripods, or industrial frames.
  • Optimized Thermal Management: Internal geometry designed to facilitate heat transfer from electronic components to the external environment.