Le MRG Profile Box is a high-end industrial enclosure system designed specifically for housing sensitive electronic components, control units, and power supplies in demanding environments. This professional dessin illustrates a modular architecture based on high-quality extruded aluminum profiles. The MRG series is favored by engineers for its structural rigidity and its natural heat-dissipation properties, which are far superior to standard plastic housings. The design features integrated internal slots that allow for the direct insertion of PCBs (Printed Circuit Boards) without the need for additional mounting hardware, making it a highly efficient solution for rapid prototyping and mass production.
By downloading this detailed dessin, you will receive a complete CAD assembly that includes the main profile body, end plates, and sealing gaskets. The design emphasizes versatility, showing how the box can be easily customized in length to accommodate different hardware configurations. The blueprint also details the precise geometry of the external heat-sink fins and the recessed areas for mounting membrane keypads or liquid crystal displays. Whether you are designing a DIN-rail mounted controller or a standalone measurement device, these files provide the exact tolerances required for professional CNC milling or laser cutting of the front and rear panels.
Utilizing this pre-engineered blueprint ensures that your electronic assembly remains protected from electromagnetic interference (EMI) while maintaining a sleek, professional aesthetic. The dessin includes all necessary fastener locations and assembly steps to ensure an IP-rated seal if required. It is an indispensable resource for electronics manufacturers and automation specialists looking for a durable, scalable, and thermally efficient housing solution.
Caractéristiques principales :
- Integrated PCB Guide Rails: Internal slots engineered into the dessin for the secure and tool-less mounting of standard-sized circuit boards.
- Extruded Aluminum Heat Dissipation: A profile design that utilizes the entire surface area of the box as a passive heat sink for internal components.
- Customizable End-Plate Layout: Detailed templates for front and rear panels that can be easily modified for connectors, LEDs, and switches.
- Modular Length Scalability: A profile-based architecture that allows the enclosure to be cut to any specific depth without redesigning the end caps.
- EMI/RFI Shielding Properties: Robust metallic construction designed to protect sensitive electronics from external signal interference.
